Multibeam Corporation

Multibeam Corporation

Semiconductors, 3951 Burton Dr, Santa Clara, California, 95054, United States, 51-200 Employees

multibeamcorp.com

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Who is MULTIBEAM CORPORATION

Multibeam has re-innovated e-beam lithography to enable cost-effective production of leading-edge semiconductors for advanced packaging, photonics, rapid prototyping, and other special ap...

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  • 3951 Burton Dr, Santa Clara, California, 95054, United States Headquarters: 3951 Burton Dr, Santa Clara, California, 95054, United States
  • 2010 Date Founded: 2010
  • 51-200 Employees: 51-200
  • dollar-icon Revenue: $10 Million to $25 Million
  • tech-icon Active Tech Stack: See technologies

industries-icon Industry: Semiconductors

SIC SIC Code: 3559

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Frequently Asked Questions Regarding Multibeam Corporation

Answer: Multibeam Corporation's headquarters are located at 3951 Burton Dr, Santa Clara, California, 95054, United States

Answer: Multibeam Corporation's phone number is +14*********

Answer: Multibeam Corporation's official website is https://multibeamcorp.com

Answer: Multibeam Corporation's revenue is $10 Million to $25 Million

Answer: Multibeam Corporation's SIC: 3559

Answer: Multibeam Corporation has 51-200 employees

Answer: Multibeam Corporation is in Semiconductors

Answer: Multibeam Corporation top competitors include: Apple , Applied Materials , ASML

Answer: Multibeam Corporation contact info: Phone number: +14********* Website: https://multibeamcorp.com

Answer: Multibeam has re-innovated e-beam lithography to enable cost-effective production of leading-edge semiconductors for advanced packaging, photonics, rapid prototyping, and other special applications. It is the industrys only maskless multi-column e-beam platform that offers full-wafer direct write patterning capabilities with fine resolution in a modular architecture that is optimized for scale. The fully automated system features multiple miniaturized e-beam delivery columns and advanced algorithms that enable precision patterning with fab-level productivity. Innovated by patterning and wafer fab equipment experts, our systems empower IC leaders to make patterns that are impossible, difficult, or too expensive for mask-based solutions, with breakthrough time-to-market advantages.

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